SMD – Surface Mount Device

SMD Assembly

Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry, it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board.

Both technologies can be used on the same board for components not suited to surface mounting such as large transformers and heat-sinked power semiconductors.

An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGA), or terminations on the body of the component.

Increase Quality And Density While Saving Time And Money

In addition to THT assembly, our electronics manufacturing also uses modern assembly machines for PCB assembly with surface-mounted device (SMD) components featuring component sizes of 01005 and higher.

SMD Assembly Enables:

  • Dense assembly of the components on the printed circuit board
  • Double-sided PCB assembly
  • Improved electrical properties of the circuit, particularly at higher frequencies

The higher component density in the SMD assembly allows for greater miniaturisation of circuits and assemblies and thereby helps to reduce costs.

Cost Benefits Of SMD Manufacturing:

  • Faster device manufacturing thanks to the pick and place process
  • Improved manufacturing quality through automated PCB assembly
  • Elimination of contamination

The SMD components are attached onto the substrate by way of reflow or wave soldering.The PCB assembly then undergoes an AOI (automatic optical inspection) test and/or an AXI (automatic X-ray inspection) test.